Item |
Parameter |
Remark |
Layer |
1-12 |
|
Max.panel size |
24" x 22"(600mm x 558mm) |
|
Min.width/space of inner |
3mil/3mil(75um/75mm) |
|
Min inner pad |
5mil(0.1mm) |
Pad annular width |
Min.inner thickness |
4mil(0.1mm) |
Except copper |
Thickness of inner copper |
1/3-4oz |
|
base copper thickness of outer |
1/3-6oz |
|
tolerance of finished board |
0.4-3.8mm |
|
Tolerance of finished board thickness |
±0.10mm |
1-4 Layer |
1.0mm≤thickness<2.0mm |
±10% |
4-8 Layer |
Thickness>2.0mm |
±10% |
4-12 Layer |
The lever between multilayer |
±2mil |
|
Min.drilling diameter |
0.20mm |
|
Min.finished diameter |
0.15mm |
|
Slot tolerance |
±3mil(±75um) |
|
Tolerance of PTH diameter |
±3mil(±50um) |
|
Tolerance of NPHT diameter |
±2mil(±25um) |
|
Max.AR of PHT |
8:1 |
|
Contraposition of image |
±0.6-2mil(15-50um) |
|
etch tolerance |
10% |
|
hardness of solder mask |
6H |
1/2oz Limited base copper |
contraposition precision of image |
±1mil |
|
Min.width of solder mask dam |
3.5mil |
|
Max.hole diameter of mask solder plugging |
0.80mm |
|
Surface pricess |
HASL OSP |
Shen Su Shen AU Shen Ag |
Scope of nickel thickness |
120U°/300U°(3um/7um) |
|
Scope of gold thickness |
1-5U° |
|
Impedance control and tolerance |
50% |
|
Warp and twist |
≤0.75% |
|